Method and apparatus for protection against process-induced charging

ABSTRACT

A semiconductor device ( 400 ) for improved charge dissipation protection includes a substrate ( 426 ), a layer of semiconductive or conductive material ( 406 ), one or more thin film devices ( 408 ) and a charge passage device ( 414 ). The thin film devices ( 408 ) are connected to the semiconductive or conductive layer ( 406 ) and the charge passage device ( 414 ) is coupled to the thin film devices ( 408 ) and to the substrate ( 426 ) and provides a connection from the thin film devices ( 408 ) to the substrate ( 426 ) to dissipate charge from the semiconductive/conductive layer ( 406 ) to the substrate ( 426 ).

FIELD OF THE DISCLOSURE

The present invention generally relates to semiconductor devices, andmore particularly relates to a method and apparatus for protection ofnodes of sensitive semiconductor devices against process-inducedcharging.

BACKGROUND OF THE DISCLOSURE

In-process charging of gate electrodes in insulated gate field effecttransistors (IGFETs) can damage the gate dielectrics of the transistors.In the most common form of IGFET, the modern MOSFET(metal-oxide-semiconductor field-effect transistor), the gate electrodeis formed from polysilicon. In a MOSFET, in-process charging commonlyoccurs during the etching of the MOSFET's polysilicon gate. Charging ofa polysilicon gate can also occur during the processing of layerssubsequent to the processing of the polysilicon gate when thosesubsequent layers are electrically connected to the polysilicon gate.These subsequent layers are typically contact layers, other polysiliconlayers and metal layers.

In a MOSFET, the in-process charging of the gate causes large voltagesand large electric fields to occur across the gate dielectric of theMOSFET. This gate dielectric is commonly silicon dioxide. Large electricfields across the gate dielectric can cause small tunneling currents toflow through the dielectric and the tunneling currents can leave chargetrapped in the dielectric. This dielectric charge can alter thethreshold voltage of the MOSFET and can also change other devicecharacteristics. Electric fields can sometimes also be large enough tocause gate to substrate breakdown or, where a doped well resides in thesubstrate, gate to well breakdown. Gate dielectric charging and gate tosubstrate or gate to well breakdown can each result in product failure.

Thus, what is needed is a method and apparatus for charge dissipationprotection which prevents a conductive or semiconductive material suchas polysilicon from accumulating damaging levels of charge duringsemiconductor fabrication. Furthermore, other desirable features andcharacteristics of the present invention will become apparent from thesubsequent detailed description of the invention and the appendedclaims, taken in conjunction with the accompanying drawings and thisbackground of the invention.

SUMMARY OF THE DISCLOSURE

A semiconductor device for improved charge dissipation protectionincludes a substrate, a layer of semiconductive or conductive material,one or more thin film devices and a charge passage device. The thin filmdevices are connected to the semiconductive/conductive layer and thecharge passage device is coupled to the thin film devices and to thesubstrate and provides a connection from the thin film devices to thesubstrate to dissipate charge from the semiconductive/conductive layerto the substrate.

A method for forming a semiconductor device with improved chargedissipation includes the steps of providing a substrate, forming acharge passage device coupled to the substrate, forming one or more thinfilm devices coupled to the charge passage device, and forming asemiconductive or conductive layer connected to the thin film devicessuch that in-process charges forming in the semiconductive/conductivelayer during processing will be dissipated to the substrate through aconnection to the substrate provided by the thin film devices and thecharge passage device.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying figures, where like reference numerals refer toidentical or functionally similar elements throughout the separate viewsand which together with the detailed description below are incorporatedin and form part of the specification, serve to further illustratevarious embodiments and to explain various principles and advantages allin accordance with the present invention.

FIG. 1 is a layout diagram of a conventional charge dissipationprotection structure;

FIG. 2 is a schematic diagram overview of a charge dissipationprotection circuit in accordance with the present invention;

FIG. 3 is a schematic diagram overview of an alternate chargedissipation protection circuit in accordance with the present invention;

FIG. 4 is a cross-sectional view of a semiconductive layer duringprocessing in accordance with the present invention;

FIG. 5 is a schematic diagram of a charge dissipation protection circuitin accordance with an embodiment of the present invention;

FIG. 6 is a layout view of a charge dissipation protection circuit inaccordance with the embodiment of the present invention depicted in FIG.5;

FIG. 7 is a schematic diagram of a charge dissipation protection circuitin accordance with an alternate embodiment of the present invention;

FIG. 8 is a layout view of a charge dissipation protection circuit inaccordance with the alternate embodiment of the present inventiondepicted in FIG. 7;

FIG. 9 is a schematic diagram of a charge dissipation protection circuitin accordance with a first memory embodiment of the present invention;

FIG. 10 is a layout view of a charge dissipation protection circuit inaccordance with the first memory embodiment of the present invention;

FIG. 11 is a flowchart of a method for forming a semiconductor device inaccordance with the first memory embodiment of the present invention;

FIG. 12 is a layout view of the charge dissipation circuit after thefirst polysilicon deposition and etch steps during the method forforming a semiconductor device in accordance with the first memoryembodiment of the present invention;

FIG. 13 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a second memory embodiment of the presentinvention;

FIG. 14 is a layout view of a charge dissipation protection circuit inaccordance with the second memory embodiment of the present invention;

FIG. 15 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a third memory embodiment of the presentinvention;

FIG. 16 is a layout view of a charge dissipation protection circuit inaccordance with the third memory embodiment of the present invention;

FIG. 17 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a fourth memory embodiment of the presentinvention;

FIG. 18 is a layout view of a charge dissipation protection circuit inaccordance with the fourth memory embodiment of the present invention;

FIG. 19 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a fifth memory embodiment of the presentinvention;

FIG. 20 is a layout view of a charge dissipation protection circuit inaccordance with the fifth memory embodiment of the present invention;

FIG. 21 is a diagram of high impedance resistors in accordance withembodiments of the present invention;

FIG. 22 is a diagram of high impedance PIN diodes in accordance withembodiments of the present invention;

FIG. 23 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a sixth memory embodiment of the presentinvention;

FIG. 24 is a layout view of a charge dissipation protection circuit inaccordance with the sixth memory embodiment of the present invention;

FIG. 25 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a seventh memory embodiment of the presentinvention;

FIG. 26 is a layout view of a charge dissipation protection circuit inaccordance with the seventh memory embodiment of the present invention;

FIG. 27 is a schematic diagram of a charge dissipation protectioncircuit in accordance with an eighth memory embodiment of the presentinvention;

FIG. 28 is a layout view of a charge dissipation protection circuit inaccordance with the eighth memory embodiment of the present invention;

FIG. 29 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a ninth memory embodiment of the presentinvention;

FIG. 30 is a layout view of a charge dissipation protection circuit inaccordance with the ninth memory embodiment of the present invention;

FIG. 31 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a tenth memory embodiment of the presentinvention;

FIG. 32 is a layout view of a charge dissipation protection circuit inaccordance with the tenth memory embodiment of the present invention;

FIG. 33 is a schematic diagram of a charge dissipation protectioncircuit in accordance with an eleventh memory embodiment of the presentinvention;

FIG. 34 is a layout view of a charge dissipation protection circuit inaccordance with the eleventh memory embodiment of the present invention;

FIG. 35 is a schematic diagram of a charge dissipation protectioncircuit in accordance with a twentieth memory embodiment of the presentinvention; and

FIG. 36 is a layout view of a charge dissipation protection circuit inaccordance with the twentieth memory embodiment of the presentinvention.

Skilled artisans will appreciate that elements in the figures areillustrated for simplicity and clarity and have not necessarily beendrawn to scale. For example, the dimensions of some of the elements inthe figures may be exaggerated relative to other elements to help toimprove understanding of embodiments of the present invention.

DETAILED DESCRIPTION

The following detailed description of the invention is merely exemplaryin nature and is not intended to limit the invention or the applicationand uses of the invention. Furthermore, there is no intention to bebound by any theory presented in the preceding background of theinvention or the following detailed description of the invention.

Before describing in detail embodiments that are in accordance with thepresent invention, it should be observed that the embodiments resideprimarily in combinations of method steps and apparatus componentsrelated to protection against process-induced charges. Accordingly, theapparatus components and method steps have been represented whereappropriate by conventional symbols in the drawings, showing only thosespecific details that are pertinent to understanding the embodiments ofthe present invention so as not to obscure the disclosure with detailsthat will be readily apparent to those of ordinary skill in the arthaving the benefit of the description herein.

In this document, relational terms such as first and second, top andbottom, and the like may be used solely to distinguish one entity oraction from another entity or action without necessarily requiring orimplying any actual such relationship or order between such entities oractions. The terms “comprises,” “comprising,” “includes,” or“including,” or any other variation thereof, are intended to cover anon-exclusive inclusion, such that a process, method, article, orapparatus that comprises a list of elements does not include only thoseelements but may include other elements not expressly listed or inherentto such process, method, article, or apparatus. An element proceeded by“comprises . . . a” does not, without more constraints, preclude theexistence of additional identical elements in the process, method,article, or apparatus that comprises the element.

In MOSFET technologies, charge dissipation protection structures providemethods for preventing the polysilicon that forms MOSFET gates fromaccumulating damaging levels of charge during product fabrication.Referring to FIG. 1, a semiconductor device 100 includes a conventionalcharge dissipation protection structure including a gate protectiondiode 102 connected from a polysilicon gate electrode 104 in MOSFETtransistors with sources and drains 105 via a metal connector 106 to thesubstrate. In the cases of transistors residing in doped wells, the gateprotection diode 102 typically connects the gate electrode 104 to thewell. The gate protection diode 102 resides in the substrate (or indoped wells that reside in the substrate) underlying the gate dielectric109. The gate dielectric 109 resides between the gate electrode 104 andthe portion of the substrate (or the portion of a doped well) that formsthe transistor's semiconducting channel. During normal operation whenthe transistor is turned on and is in its conducting state thesemiconducting channel electrically connects the transistor's drain toits source (i.e., sources and drains 105). The gate protection diode 102is formed by doping the substrate (for example, an N+ dopant could beused in a P doped substrate to form the gate protection diode 102). Thegate protection diodes 102 are normally reversed biased during productoperation. In-process charging can cause the diodes 102 to forward biasor to reverse bias during circuit fabrication. Normally, process-inducedcharge is small enough that even the relatively small reverse saturationcurrents in the diodes 102 are large enough to adequately dissipate gatecharges induced during processing.

This conventional charge dissipation protection structure has severaldrawbacks. First, in most processes, the first interconnect layer to beelectrically isolated from the substrate is a polysilicon layer used forthe MOSFET gate electrodes 104. In such semiconductor devices, chargecannot be dissipated from the polysilicon layer until after contacts aremade to the polysilicon layer and those contacts are then connectedthrough a connection 106 in the semiconductor device's first metal layerto the charge dissipating gate protection diodes 102. This first metallayer is normally created after the polysilicon layer. In suchsituations, charge that occurs on the MOSFET polysilicon gate electrodes104 during polysilicon processing (such as during polysilicon etching)and during contact formation is not dissipated except through the gatedielectrics 109 of the MOSFETs themselves. In short, there is normallyno charge-dissipating protection until the first metal layer (or otherinterconnect layer) after the polysilicon is created.

A second drawback to the conventional charge dissipation protectionstructures is that the conventional charge dissipation protectionstructures require substantial layout space to create. At a minimum, theconventional charge dissipation protection structures require the areaof a contact 108 from each polysilicon gate 104 or from each group ofcommon-connected polysilicon gates 104 to the metal interconnect 106,the area of the metal interconnect 106, the area of a contact 110 fromthe metal interconnect to one of the diffused source-drain regions thatform the diode 102, and the area of the protection diode 102, thesource-drain regions and the protection diode 102 occupying space in thesubstrate or in doped wells in the substrate. Thus, as is well-known tothose skilled in the art, conventional charge dissipation protectionstructures require significant layout space.

This drawback of the conventional charge dissipation protectionstructures is magnified in semiconductor devices wherein large numbersof different, not commonly-connected polysilicon gate electrodes 104 areformed in a relatively small area, such as in memory arrays with a largenumber of word-lines (gates) in an array.

To address the charging problems and charge-induced damage problems thatwould otherwise occur during gate layer etch (commonly duringpolysilicon layer etch) and during subsequent layer etch steps, chargedissipation protection structures in accordance with embodiments of thepresent invention are formed earlier in the processing of thesemiconductor device than the conventional charge dissipation protectionstructures. In addition, charge dissipation protection structures inaccordance with embodiments of the present invention also use lesslayout space than the conventional charge dissipation protectionstructures.

Referring to FIG. 2, a semiconductor device 200 in accordance with thepresent invention provides charge dissipation protection for thin filmgate electrodes 202 (such as polysilicon gate electrodes) of numeroustransistors 204 connected to a common node 205 using a single chargepassage device 206 to pass charge from the thin film polysilicon layer208 to the substrate 210. In this manner, the function of conventionalcharge dissipation methods' substrate-resident, well-resident, or buriedcontact to substrate interface-resident charge dissipation diodes withdevices resident in the poly-silicon thin film are replaced. In thesemiconductor device 200, the replacement devices 212 are high impedancethin film resistors solely in the polysilicon 208 or high impedance thinfilm diodes solely in the polysilicon 208. These thin film devices 212then pass charge from the thin film polysilicon 208 to the substrate 210via the charge-passage device 206. In addition to protection of the thinfilm gate electrodes 202 such as those in the polysilicon of thesemiconductor device 200, the charge dissipation protection scheme inaccordance with the present invention could provide protection forsemiconductive and conductive materials other than polysilicon and couldprovide protection for structures such as thin film gate or gate-likenodes in other types of semiconductor technologies.

Referring to FIG. 3, an alternate embodiment of the semiconductor device200 in accordance with the present invention provides charge dissipationprotection for the thin film gate electrodes (such as polysilicon gateelectrodes) of numerous transistors 204 that have non-common gateelectrodes 220, using the single charge passage device 206 to passcharge from the thin film polysilicon layer 208 to the substrate 210.The non-common gate electrodes 220 are connected to different nodes 221.Between the gate electrodes 221 are high impedance thin film devices 222solely in the polysilicon 208, such as high impedance thin filmresistors or high impedance thin film diodes.

In accordance with one embodiment, the semiconductor device 200 could bea memory device comprising a plurality of memory cells, each cell beingeither a single-bit memory cell or a multi-bit memory cell. One exampleof a multi-bit per cell memory device is a MirrorBit® memory devicemanufactured by Spansion, LLC of Sunnyvale, Calif., the assignee of thepresent patent. A MirrorBit memory device is a nonvolatile, electricallyprogrammable memory device wherein two bits may be stored in twolocalized areas of a single memory cell. As in many memory devices, aMirrorBit memory cell includes a gate electrode formed of a thin filmsemiconductive material, the thin film gate electrode material beingconnected to gate electrodes of other memory cells by word lines. Inaccordance with the present invention, the thin film word lines can beprotected from in-process charging without impacting the performance ofthe memory devices, i.e., the charge dissipation protection structurescan dissipate charging of the gate electrodes during processing while,during normal operation, function primarily as open circuits, such as inthe presence of positive and negative voltage polarities provided acrossthe protection structures. For example, in MirrorBit memory devices,positive voltages are applied to the word lines during programming andread operations and negative voltages are applied to the word linesduring erase operations.

The semiconductor device 200 advantageously provides one single chargepassage device for passing charge from a multitude of gate electrodes tothe substrate rather than the conventional solution of providing onecharge passage device per gate electrode. The semiconductor device 200moreover can provide charge dissipation protection for multiplenon-common gates 220, i.e., gates 220 connected to different nodes 221,using a single charge passage device 206 to pass charge from thepolysilicon thin film layer 208 to the substrate 210 or to a doped wellresiding in the substrate 210. In addition, the semiconductor device 200advantageously provides charge dissipation protection immediately at theonset of polysilicon layer processing rather than the conventionalsolution of not providing protection until the first contact and metallayer step after polysilicon processing because the thin film highimpedance devices 212, 222 are fabricated from the same thin filmsemiconductive material 208 as the gate electrodes 202, 220.

The essential elements of the charge dissipation protection structure ofthe semiconductor device 200 are one or more thin film devices 212, 222and a single charge passage device 206. The one or more thin filmdevices 212, 222 are comprised of thin film high impedance chargeleakage devices 212, 222 which transport charge from a first portion ofa piece of semiconductive material 208, such as polysilicon, that is tobe protected, such as the gate 220 of a MOSFET transistor 204 or gates202 of a group of MOSFET transistors 204 sharing the same gate node 205,to a second portion of the same piece of semiconductive material 208.Charge can then be dissipated from this second piece of thesemiconductive material 208 into the underlying substrate 210 orunderlying doped well. The thin film high impedance charge leakagedevices 212, 222 have large enough impedances that, during normalproduct operation, they effectively electrically isolate the secondportion of the piece of semiconductive material 208 from the firstportion.

Despite the relatively high impedances of the thin film charge leakagedevices 212, 222, though, the impedances of these one or more thin filmdevices 212, 222 are designed to still be low enough to allow the one ormore devices 212, 222 to pass enough charge during processing to allowthe devices 212, 222 to provide adequate protection for the gateelectrodes 202, 220 against process-induced charging. This is becausethe currents needed to dissipate process-induced charges are very smallcompared with the currents that would be considered appreciable duringnormal product operation. In the semiconductor device 200 in accordancewith the present invention, these thin film high impedance chargeleakage devices 212, 222 take the form of high impedance thin filmdiodes or high impedance thin film resistors.

Once charge passes from the first portion of a piece of thesemiconductive material through the thin film high impedance chargeleakage device(s) 212, 222 to the second portion of a piece of thesemiconductive material, the charge is then passed from the thin filmlayer (e.g., polysilicon layer 208) to the substrate 210 or to a dopedwell residing in the substrate 210. Devices used for conducting chargefrom the thin film layers 208 to the substrate 210 or to doped wells aretermed herein charge passage devices 206.

In accordance with the present invention, one component of the chargepassage device 206 is the above-mentioned second portion of the piece ofsemiconductive material. Charge passage devices 206 may be gate oxidecapacitors connecting the semiconductive material 208 to the substrate210 or to a doped well in the substrate 210. Alternatively, the chargepassage devices 206 may be buried contacts from the second portion ofthe piece of semiconductive material 208 to the underlying substrate 210or to a doped well residing in the underlying substrate 210.

Thus, a thin film high impedance charge leakage device 212, 222 connectsthe semiconductive material of the gates 202, 220 of the transistors 204being protected directly or indirectly to the semiconductive materialconnected to a charge passage device 206. The charge passage device 206then passes the charge from the semiconductive material 208 to theunderlying substrate 210 or to an underlying doped well.

Referring to FIG. 4, a cross-section of a semiconductor device 300during fabrication in accordance with the present invention is depicted.A substrate 302 is provided and one or more thin film devices can beformed in a portion 304 of the undoped or lightly doped polysilicon(i.e., semiconductive) layer 306 by masking such portion 304 with a masklayer 308 to block the portion 304 of the poly-silicon from being dopedwith additional impurities (forming mask 308 prior to ion implantation)and by preventing the portion 304 of the polysilicon from having metalsilicide 310 deposited on top thereof. Thus, the doped polysilicon 312,314 can have a reduced impedance thereby permitting currents to easilypass therethrough. In this manner, high impedance resistors havingresistances on the order of ten to one hundred mega-ohms can be formedby limiting the doping in portions of the polysilicon 304 (theresistors) to small amounts. Even higher levels of resistance can beattained when no impurities are allowed to dope the portion 304 of thepolysilicon. The background impurity levels in the polysilicon layer 306can be adjusted via masked ion implants or blanket ion implants of thepolysilicon to optimize values of resistor impedances for protectionagainst in-process charging and for correct circuit functioning duringnormal circuit operation.

Use of the same mask layer 308 to pattern the region 304 of thepolysilicon that is blocked from additional ion implant and to patternthe region 304 of the polysilicon that does not have metal silicidedeposited thereon can advantageously be accomplished by using the samesilicon nitride (Si₃N₄) layer 308 to define the mask used to pattern theregions of poly-silicon that have metal silicide blocked as well aspatterning the regions of the poly-silicon that are not additionallydoped. The silicon nitride layer 308 both blocks the formation of metalsilicide 310 on the undoped or lightly doped polysilicon 306 and blocksthe ion implant that would otherwise dope the polysilicon 312, 314 and,therefore, provides the advantages of only requiring a single mask stepfor patterning the high impedance thin film devices 304 andself-aligning the not additionally doped portion 304 of the undoped orlightly doped polysilicon 306 with the portion 304 which is non-metalsilicided. With an additional mask step (typical already extant in mosttechnologies), differing polarities of impurities (acceptor impuritiesand donor impurities) can be used to dope different regions 312, 314 ofthe doped silicon. By doping one region of polysilicon 312 with donorimpurities and a second region 314 with acceptor impurities andseparating the two regions with an undoped region 304, a high impedanceP+/Insulator/N+ (PIN) diode can be formed in the thin film. As with thethin film resistors, adjusting the background impurity levels in thepolysilicon layer 306 can be done in order to attain optimum impedancelevels in the PIN diode. In some devices it is advantageous to createhigh impedance thin film PIN diodes rather than high impedanceresistors. Diodes can sometimes be used, for example, in cases in which,for reasons unrelated to charging protection, two portions of thepolysilicon must be doped with opposite polarities of dopants. In suchcases, PIN diodes connecting two such portions can often require lessarea to implement than can high impedance resistors connecting thosesame two portions.

Referring to FIGS. 5 and 6, a semiconductor device 350 having a chargedissipation protection structure is depicted. FIG. 5 is a schematicdiagram showing a number of gate electrodes 352 (G1, G2, G3, G4 and G5)of transistors 353 (including gate electrodes 352 and source-drains 354)connected through a number of high impedance thin film polysiliconresistors 355 to a charge passage device 356. The transistors 353 havedifferent gate nodes connected to each other through the high impedanceresistors 355, all of the transistors 353 protected with a single chargepassage device 356 and a single polysilicon grounding connection 357,thereby saving substantial layout space.

The charge passage device 356 dissipates gate charge from the thin filmlayer 358 in which the gate electrodes 352 and the high impedanceresistors 355 are formed to the substrate 360 underlying the transistors352. FIG. 6 is layout depiction of the portion of the semiconductordevice 350 depicted in the schematic diagram of FIG. 5 wherein thecontacts 362 are connected to the substrate 360. The portion of thesemiconductor device 350 shown in FIGS. 5 and 6 preferably includesperipheral transistors 353 that are logic circuit transistors or analogcircuit transistors making up standard complementary metal-oxidesemiconductor (CMOS) circuitry.

The charge passage device 356 is formed by creating a thin gate oxidefrom the polysilicon 358 to the substrate 360. The low voltage thin gateoxide is formed by depositing polysilicon over the source-drains in thesubstrate 360 and provides a path for charge to leak (i.e., tunnel) fromthe polysilicon to ground. In this manner, the thin gate oxide chargepassage device 356 exists before the polysilicon 358 is etched, therebyproviding charge dissipation protection during the polysilicon etch. Theoxide thickness of the charge passage device 356 is preferably thinnerthan the oxide in the transistor gates 352, such as thirty nineAngstroms (39 Å). Nevertheless, forming the charge passage device 356having an oxide layer with the same thickness as the oxides in thetransistor gates 352 still provides ample charge dissipation protection.Providing a thinner oxide layer for the charge passage device 356 thanthe oxide layer of the transistor gates 352 being protected by thecharge passage device 356 provides particularly effective chargedissipation protection and, though problematic in some fabricationprocesses, is practical in fabrication processes using several differentoxide thicknesses. While the charge passage device 356 describedhereinabove is a thin low voltage gate oxide device, any device that canpass charge from the polysilicon 358 to the substrate 360 could be usedas a polysilicon to substrate charge passage device 356 and, when usedin conjunction with the high impedance charge leakage thin film devices355 formed in the polysilicon 358 provide a charge dissipationprotection structure in accordance with the present invention whichprovides substantial protection against process-induced charging for thethin film polysilicon layer 358.

Having the charge passage device 356 reduces the polysilicon layer's 358“antennae ratio”. This ratio is defined for a single piece ofpolysilicon as the total area of the piece of polysilicon divided by thesum of the areas of the thin oxide regions between the substrate (ordoped well) and that piece of polysilicon. The effects ofprocess-induced charging are much greater and, consequently, much moreharmful, when the antennae ratio associated with the piece ofpoly-silicon is much larger than one. Accordingly, providing the chargepassage device 356 reduces the antennae ratio which, in turn, rendersthe semiconductor device 350 much less susceptible to the effects ofprocess-induced charging.

As described above, the charge passage device 356 is a low voltage thingate dielectric that is formed between the polysilicon 358 and anunderlying layer of source-drain region in the substrate 360 (i.e., thetype of substrate region used to form the sources, drains and channelsof some of the technology's MOSFETs). The dielectric in the chargepassage device 356 is advantageously formed thin enough that thedielectric allows charge to tunnel through it or to pass through it in adielectric breakdown mode to dissipate any process-induced charges fromthe polysilicon layer 358 to the substrate 360. Such charge tunnelingmay damage the dielectric of the charge passage device 356; however suchdamage is not problematic because the dielectric could even become ashort circuit and the semiconductor device 350 will still function asdesigned. In fact, in accordance with the present invention, shortingthe thin dielectric would advantageously pass process-induced chargewithout having any negative consequence to operation or reliability ofthe semiconductor device 350. In addition, the charge passage device 356is formed at the time that the polysilicon layer 358 is formed, therebyproviding a thin gate charge passage device 356 that is capable ofpassing and dissipating process-induced charge as soon as deposition ofthe polysilicon layer 358 begins in the process of fabricating thesemiconductor device 350.

The low voltage thin gate dielectric charge passage device 356 isaugmented by an electrically parallel secondary polysilicon to substratecharge passage device 357. Polysilicon to ground connections areprovided by the secondary charge passage device's 357 connections viametal, contacts and source-drain from the polysilicon 358 to thesubstrate 360 or to a doped well residing in the substrate 360. Thesecondary charge passage device 357 is formed subsequent to thepolysilicon deposition process step. After its formation in the firstmetallization step, the secondary charge passage device 357 providesadded charge dissipation protection by dissipating charge during thefirst metal etch step and during all subsequent process steps. Thesecondary charge passage device 357 used in parallel with the thindielectric charge passage device 356 reduces the combined impedance ofthe polysilicon to substrate charge passage devices once the secondarycharge passage device 357 is formed during processing.

The secondary charge passage device 357 is formed from one or morecontacts from the polysilicon 358 to the first layer of metal combinedwith one or more contacts from that layer of metal to the substrate 360.Once the first layer of metal is deposited, the impedance of thecombined polysilicon to substrate charge passage device 356, 357 is verylow, providing improved charge dissipation protection. Furthermore,while the impedance of the thin dielectric polysilicon to substratecharge passage device 356 is low enough to allow the charge passagedevice 356 to provide effective protection against process-inducedcharging during polysilicon deposition, during polysilicon etching andduring formation of contacts to the polysilicon, adding the secondarycharge passage device 357 ensures adequate protection during metaldeposition, metal etching and subsequent processing steps, processingsteps that typically have more process-induced charging associated withthem than the thin dielectric charge passage device 356 may effectivelydissipate.

In an alternative embodiment of the present invention, the chargepassage device can be formed from simple links between the polysiliconand the substrate via contacts 362 from metal lines 357 to thepolysilicon 358 and then contacts from the metal lines 357 to thesubstrate 360. Although this embodiment does not provide protectionbefore the deposition of the first metal layer, thereafter the chargepassage device would provide a charge dissipation protection structurewhich requires less layout area on the semiconductor die than aconventional charge dissipation protection structure.

Referring to FIGS. 7 and 8, FIG. 7 depicts a schematic diagram and FIG.8 depicts a layout diagram of a charge dissipation structure in asemiconductor device 380 in accordance with yet another alternateembodiment of the present invention. The charge dissipation structure ofthe semiconductor device 380 differs from the charge dissipationstructure of the semiconductor device 350 depicted in FIGS. 5 and 6 inthat the charge passage device 382, rather than being a thin oxidetunneling device 356 (FIGS. 5 and 6), includes one or more buriedcontacts 384. The buried contacts 384 directly connect the polysilicon358 to an underlying source-drain region 386 (FIG. 8) residing in thesubstrate 360 or residing in a doped well formed in the substrate 360.For semiconductor devices 380 which accommodate the use of buriedcontacts 384, a charge dissipation protection structure in accordancewith this alternate embodiment of the present invention is extremelyeffective. Like the thin gate dielectric charge passage device 356(FIGS. 5 and 6), a charge passage device 382 including buried contacts384 would have the advantage of already existing and of being availableto pass and dissipate process-induced charge as soon as the polysiliconlayer 358 deposition begins. In addition, when properly optimized, thecharge dissipation protection structure in accordance with the alternateembodiment of the present invention depicted in FIGS. 7 and 8 couldpotentially alleviate all problems caused by in-process charging whilealso requiring less layout space than conventional charge dissipationprotection structures.

Referring to FIGS. 9 to 36, embodiments of the present invention in aMirrorBit memory device wherein polysilicon gate electrodes function asmemory word lines are depicted and charge dissipation protectionstructures suitable for protecting MirrorBit core transistors fromaccumulating damaging amounts of process-induced charge are shown. Whilethe embodiments shown in FIGS. 9 to 36 are described in accordance withMirrorBit memory devices, the charge dissipation structures depicted canalso be used to protect similar gates of transistors and portions ofother devices in other types of semiconductor memory cores, such asfloating gate Flash EPROMs, standard EPROMs, DRAMs and SRAMs.

FIGS. 9 and 10 depict a schematic diagram and a layout diagram,respectively, of a memory device 400 in accordance with a first memoryembodiment of the present invention including a core memory array 402and an X-decoder 404 for controlling voltages applied to word lines 406.The word lines 406 that form the gates of MirrorBit core transistorsmust be very well protected from accumulating process-induced charge.Also, maintaining fine gradations in the threshold voltage levels ofMirrorBit core transistors is critical to the proper functioning ofMirrorBit semiconductor memory devices 400. In addition, semiconductormemory device 400 yields and reliability can be seriously compromised ifcore transistor gate dielectrics are charged or damaged byprocess-induced charging.

Referring to FIG. 9, the memory array 402 includes sixty-four word lines406, each of the word lines connected to its own high impedancepolysilicon resistor 408. The sixty-four word lines 406 make up a sectorof the memory array 402. A sector is defined as the smallest portion ofa memory array that will be erased at one time. A memory array containsone or more sectors. While the array 402 shown in FIG. 9 contains onlyone sector, and that sector includes sixty-four word lines, thoseskilled in the art will understand that memory arrays come in many sizeswith sectors including memory cells connected to either more than orless than sixty-four word lines 406. When a memory sector is erased, allof the word lines 406 in that sector are driven to a common negativevoltage.

In MirrorBit memory devices 400, negative voltages are applied to theword lines 406 during erase operations and positive voltages are appliedto the word lines 406 during programming and read operations. The chargedissipation protection structures in accordance with the first memoryembodiment of the present invention provides protection of the wordlines 406 from in-process charging while enabling the memory device 400to function correctly during normal product operation by acting largelyas open circuits during erase, programming and read operations (i.e., inthe presence of positive and negative voltage polarities across theprotection structures). This is because protection structures inaccordance with the first memory embodiment of the present invention usehigh impedance polysilicon thin film resistors 408 in series with eachof the word lines 406. Thus, the resistors 408 are designed to haveresistor impedances such that the resistors have high enough resistorimpedances to act primarily as open circuits during normal productoperation while having low enough resistor impedances to act asconductors of process-induced charge during processing.

The high impedance resistors 408 are made in portions of the polysiliconthat have had the normal metal-silicide deposition and reaction blockedtherefrom (i.e., gaps in the metal-silicide are formed over thepolysilicon in the resistors 408). The resistors 408 are either undopedor lightly doped. The resistors 408 are connected between the word lines406 and a polysilicon spine 410. In accordance with this embodiment, thespine 410 is made from a portion of the polysilicon layer that is dopedand which has metal-silicide formed thereon, thereby providing a lowimpedance spine 410. In accordance with this embodiment, there are oneor two polysilicon spines 410 for each memory sector. With hundreds ofword lines in each sector and often with multiple sectors in each memoryarray, hundreds of word line resistors 408 could be connected to asingle spine 410.

The polysilicon spine 410 is connected to one or more undoped or lightlydoped high impedance polysilicon grounding resistors 412 to enable theword lines 406 to attain relatively high voltages during programming anderase operations by isolating the high voltages in the polysilicon tothe word lines 406 therein. Thus, while commonly connected to the spine410, the impedances of the resistors 408 is large enough to virtuallyisolate each word line 406 from the rest of the word lines 406 duringthe read and programming phases of normal product operation. Duringerase, when all of the word lines 406 in a sector are simultaneouslydriven negative in voltage, the spine 410 may also be drawn to anegative voltage by leakage currents from the word lines 406 through theresistors 408. The grounding resistors 412 prevent the negative goingspine 410 from directly shorting to ground. By not shorting the spine410 directly to ground, current leakages from the word lines 406 arereduced.

When there is more than one grounding resistor 412 connected to thespine 410, the grounding resistors 412 are connected in series or inparallel with one another to facilitate the tuning of the overall valueof the grounding resistor set. A first set of terminals of the groundingresistors 412 is connected to the spine 410. The other terminals of thegrounding resistors 412 are connected to a polysilicon terminal of agate oxide charge passage device 414. The gate oxide charge passagedevice 414 is a relatively thin dielectric polysilicon to substratecapacitor or polysilicon to doped well capacitor. In this embodiment,the dielectric in the capacitor 414 is significantly thinner than thegate dielectrics of the MirrorBit core transistors being protected. Thethin gate oxide allows the passage of process-induced charge that hasaccumulated on the memory word lines 406 through the charge passagedevice 414. Charge can pass through the charge passage device's thinoxide via carrier tunneling or through oxide breakdown. Duringprogramming and erase operations, the grounding resistors 412 preventthe high voltages that are placed on the word lines 406 from reachingthe charge passage device 414.

The charge passage device 414 is adequate for protecting the polysiliconword lines 406 forming the gates of the MirrorBit core transistors fromthe damaging levels of charge that would otherwise accumulate thereondue to process-induced charging during polysilicon etching. For enhancedprotection against process-induced charging, subsequent to thepolysilicon processing, a second charge passage device 416 is formedduring metal deposition processing by forming a metal connection 416placed in parallel with the thin dielectric polysilicon to substratecapacitor or polysilicon to doped well capacitor 414. The second chargepassage device 416 is a metal connection of deposited metal betweenmetal to polysilicon contacts and metal to source-drain contacts. Thepolysilicon portion of the charge passage device 416 also connects tothe grounding resistors 412.

Referring to FIG. 10, a layout diagram of the charge dissipationstructure in a memory device 400 in accordance with the first memoryembodiment of the present invention is shown. The memory array 402 (FIG.9) consists of bit lines 405 coupling the source-drain regions of theMirrorBit core transistors and word lines 406 coupling the gates thereofwith a layer of dielectric 418, such as an oxide-nitride-oxide layer 418formed between the bit lines 405 and the word lines 406 in a mannerwell-known to those skilled in the art. The word lines 406, theresistors 408, the spine 410, the grounding resistors 412 and part ofthe charge passage device 414 are formed during deposition of a singlelayer of polysilicon as shown by the outlined portions of these linesand devices 406, 408, 410, 412, 414.

At the end of the word lines 406, the high impedance resistors 408 areformed by blocking metal silicide formation in a region 420. While thespine 410 and the regions connecting the resistors 408 to the word lines406 and the spine 410 are donor doped (i.e., doping the poly-siliconwith N+ (donor type) dopant) in regions 422, the high impedanceresistors 408 are formed in undoped or lightly doped silicide-blockedpolysilicon. Likewise, the grounding resistors 412 are formed in undopedor lightly doped silicide-blocked polysilicon regions 424 between andconnected to the donor doped regions 422.

In accordance with the first memory embodiment of the present invention,the connection between the high impedance resistors 408 and the wordlines 406 includes a donor doped region 422, preferably, of two microns,half of which is silicide-blocked. The high impedance resistors 408 arepreferably formed in a 2.4 micron central portion of the undoped orlightly doped silicide-blocked polysilicon region 420 betweensilicide-blocked portions of the donor doped regions 422 of, preferably,one micron polysilicon widths.

The charge passage device 414 is a thin gate oxide charge leakage deviceformed from polysilicon over, and connected to, a source-drain region426 as ground. The thin gate oxide is, preferably, about thirty-nineAngstroms thick, thereby providing a path for charge to leak from thepolysilicon layer to ground (i.e., the source-drain region 426) prior tothe first metallization step following deposition of the polysiliconlayer. During the first metallization step, the polysilicon to metal tosource-drain region grounding connection 416 is formed to augment theflow of charge through the charge passage device 414.

All of the polysilicon devices 406, 408, 410, 412, 414 are portions ofone or two polygons of polysilicon, wherein each polygon includes wordlines 406, individual word line resistors 408, the polysilicon spine410, grounding resistors 412, and the polysilicon gate portion of thepolysilicon to substrate or well capacitor 414. The schematic and layoutof FIGS. 9 and 10 depict only one polysilicon spine 410 used in a memorysector. In alternate embodiments, two polysilicon spines 410 may be usedfor a single memory sector. In such embodiments, half of the word lines406 in the sector connect through high impedance thin film resistors 408to one spine 410 and the other half of the word lines 406 connectthrough high impedance thin film resistors 408 to the other spine 410.Such embodiments include two polygons of polysilicon with each polygoncontaining half of the word lines 406, half of the individual word lineresistors 408, one polysilicon spine 410 and the gate portion of thepolysilicon to substrate or well capacitor 412.

One embodiment of a method 500 for fabricating the memory device 400 inaccordance with the first memory embodiment of the present invention isdepicted in FIG. 11. While a number of processing steps are shown inFIG. 11 that pertain to fabrication of the memory 400 in accordance withthe first memory embodiment of the present invention, those skilled inthe art will realize that these are only a portion of the stepsnecessary for fabricating the memory device 400 and that additionalsteps may vary from manufacturer to manufacturer, factory to factory ordevice to device. The processing steps shown in FIG. 11 and discussedhereinbelow are those steps pertaining to the formation of the chargedissipation protection structure of the memory device 400.

Initially, a substrate is provided 502 for fabricating the memory device400 thereon. In addition to providing the substrate, step 502 couldinclude doping the substrate to form doped wells therein. Source-drainregions are formed 503 in the substrate. Formation of these source-drainregions creates the bottommost layer of the charge passage device 414(FIG. 10).

The first polysilicon layer is deposited at step 504. Deposition of thisfirst polysilicon layer forms the topmost layer of the charge passagedevice 414 (FIG. 10). For example, if the charge passage device 414 is athin oxide MOS capacitor (i.e., a MOSFET with drain and source connectedtogether) the first polysilicon layer being formed over a source-drainregion 426 (FIG. 10) forms a thin gate oxide layer therebetween whichacts as the gate electrode of the capacitor 414. Thus, processing step504 completes formation of the charge passage device 414. Thepolysilicon of the first polysilicon layer connects the polysiliconsemiconductive layer of the device to be protected (i.e., the gateelectrodes of the memory core transistors) to the charge passage device414. A first current path is then formed between the device to beprotected and the charge passage device 414. This first current path maybe referred to as a “sneak path”.

The dielectric beneath the first polysilicon layer in the charge passagedevice 414 may be the same as or different from the dielectric beneaththe first polysilicon layer in the device to be protected. In accordancewith the first memory embodiment, the dielectric in the charge passagedevice 414 is a thirty-nine Angstrom thick silicon dioxide layer whilethe dielectric in the device to be protected (the core memorytransistor) is an oxide nitride oxide layer 418 and is thicker (beingcomposed of stacked layers of silicon dioxide, silicon nitride andsilicon dioxide).

At step 506, the first polysilicon layer is etched (i.e., patterned). Inthe case of the MirrorBit memory device 400, the regions of the firstpolysilicon layer residing over the memory array's 402 (FIG. 9) buriedbit lines 405 (FIG. 10) are etched away. The first polysilicon layerpatterning does not etch away or interrupt the first current paththrough the remaining first polysilicon layer from the device to beprotected to the charge passage device 414.

Referring to FIG. 12, the memory device 400 after step 506 is shown. Thefirst polysilicon layer 550 is shown with etched holes 552 over thebit-lines 405. The first current path 555 from the devices to beprotected (the gate electrodes of the memory core transistors) to thecharge passage device 414 is shown. Also, shown in outline form are theword lines 406, the word line protection resistors 408, the spine 410and the grounding resistors 412. As the process discussed herein is atwo layer polysilicon process, completion of these devices in the chargedissipation protection structure are formed of the first layer ofpolysilicon and the second layer of polysilicon.

Referring back to FIG. 11, ion implantation at step 508 causes ionimplant to pass through the etched holes 552 in the first layer ofpolysilicon 550 over the buried bit lines 405 to dope the buried bitlines 405. The first layer of polysilicon 550 and the holes 552therethrough are patterned in such a way as to determine precisely wherein the substrate the implant goes. This implant to the buried bit lines405 is “aligned” to the position of the buried bit lines 405 by theholes 552 in the first layer of polysilicon 550 (e.g., a self-alignedgate process).

After the implantation step 508, the holes in the first layer ofpolysilicon 550 are filled by deposition 510 of an insulating layer suchas an oxide (e.g., silicon dioxide) 418. The oxide or other insulatinglayer 418 is also deposited 510 over other portions of the first layerof polysilicon 550. Thereafter, the oxide or insulating layer ispolished away 510 leaving oxide or insulator only in the holes in thefirst layer of polysilicon 550 over the bit lines 405. The depositionand polishing of the oxide layer at step 510 does not affect the firstcurrent path 555 through the remaining first layer of polysilicon 550between the device to be protected and the charge passage device 414.

The second polysilicon layer is deposited at step 512 and contacts allof the first polysilicon layer that remains after the first polysiliconlayer etch step 506. The underside of the second polysilicon layercontacts the top side of the first polysilicon layer. The secondpolysilicon layer over the charge passage device 414 and over the deviceto be protected is connected in this way to the first polysilicon layerover both devices. The second polysilicon layer forms a secondconducting path between the polysilicon semiconductive layer of thedevices to be protected (i.e., the word lines 406 that form the gateelectrodes of the memory core transistors) and the polysiliconsemiconductive layer of the charge passage device 414. This secondcurrent path is electrically in parallel with the first current path 555and forms the charge dissipation protection structure by passing throughthe portions of the polysilicon corresponding to the word lines 406, theword line protection thin film devices 408, the spine 410, the groundingresistors 412 and the charge passage device 414. A portion of the secondcurrent path in the second polysilicon layer is utilized to create theone or more thin film devices 408.

At step 513, background impurities can be ion implanted into the secondpolysilicon if desired. These impurities can be selectively added toportions of the second polysilicon by using one or more masks to blockimplantation to portions of the second polysilicon. Alternatively, thefull layer of second polysilicon can be implanted in a blanket fashionby omitting a blocking mask. Differing impurity concentrations can beimplanted into different portions of the second polysilicon layer if oneor more blocking masks are used and two or more implant steps areemployed. For example, a blanket implant can be made to the full secondpolysilicon layer and then a blocking mask can be used to pattern ablocking layer to block a second implant from portions of the secondpoly silicon layer. In this way, some portions of the second polysiliconlayer will be doped by both implants (blanket implant and secondimplant) while others will only be doped by the blanket implant. Ifdesired, these implants can be used to optimize the impedances of thehigh impedance portions of the various thin film resistors and diodesshown in the various memory embodiments depicted in FIGS. 9 through 36(408, 412, 622, etc.). Otherwise these implant steps can be skipped andthe polysilicon's impedance will be left in its as-deposited state(typically a high impedance state).

At step 514, the second polysilicon layer and the underlying firstpolysilicon layer are etched. The second current path is active duringthis etch step and continues to exist and to be active after the etchstep and through subsequent processing steps. The etch step severs thefirst current path 555 (i.e., removes the sneak path).

After etching the second polysilicon layer and the underlying firstpolysilicon layer 514, one or more thin film devices 408 are formed 516.The thin film devices 408 are formed in portions of the secondpolysilicon layer that constitute the second current path. In addition,the second current path is modified by the deposition of metal silicideon portions of the second polysilicon layer that forms the path.Portions of the second polysilicon layer in the path are also ionimplanted.

Each of the one or more thin film devices 408 is formed 516 within aportion of the second polysilicon layer by implants to the portion ofthe second polysilicon layer and by blocking the formation of metalsilicide over the portion of the second polysilicon layer. In accordancewith the first memory embodiment of the present invention, the thin filmdevices 408 are formed in a portion of a second polysilicon layer lineby blocking metal silicide from forming over a portion of the line andthen applying ion implants to the ends of the portion of the line thatare void of silicide. In this manner, high impedance devices such as thehigh impedance resistors 408 are formed. Thin film devices havingvarious impedances may also be formed by employing various implant andsilicide block configurations.

With the formation of the one or more thin film devices 408 in thesecond current path, the second current path takes on the resistance ofthe thin film device(s) 408 in addition to any other resistances in thepath. These other resistances are small in value relative to theresistance of the high impedance thin film device(s) 408. The thin filmdevice(s) 408 are formed in the polysilicon that resides between thedevice or devices to be protected on the word lines 406 and the chargepassage devices 414.

A self aligned thin film device 408 may be formed when the siliconnitride placed on a portion of the second polysilicon layer to blockformation (i.e., deposition and formation) of silicide on that portionof the second polysilicon layer is also used to block ion implantationto that portion of the second polysilicon layer. Utilizing the siliconnitride or other silicide blocking agent in this manner causes the gapin the ion-implanted portions of the second polysilicon layer to be selfaligned to the gap in the silicide.

The step 516 can also be used to place more than one thin film device inseries in the second current path (e.g., the word line protectionresistors 408 and the grounding resistors 412). Further, numerouscurrent paths similar to the above-described second current path can becombined to form networks of such current paths. Thus, in accordancewith the method 500 for formation of the memory device 400 in accordancewith the first memory embodiment of the present invention, thecombination of the first and second current paths protects the devicesto be protected during deposition of the first polysilicon layer and allsubsequent processing steps.

After the polysilicon related processing is completed, connections areformed at step 518 through contacts to the polysilicon, first layer ofmetal and contacts to grounded source-drain regions to create the polygrounding connection 416. This current path 416 exists after formationof the first metallization layer 518 and through all subsequentprocessing.

Referring to FIGS. 13 and 14, a schematic diagram and a layout view of amemory device 600 in accordance with a second memory embodiment of thepresent invention are shown. The memory device 600 is similar to thememory device 400 (FIGS. 9 and 10) except that the spine 410 does nothave metal-silicide formed over it and is not doped. In accordance withthe present invention, the spine 410 can be of low or high impedanceand, depending upon the requirements of a particular application forconductivity or resistivity in the spine 410, the spine 410 can befabricated with or without metal-silicide and with or without doping.

Referring to FIG. 13, the spine 410 is made of high impedance materialand, in essence, includes high impedance resistors 602 which merge withthe high impedance resistors 408 connected to the word lines 406.Referring to FIG. 14, the gaps in the metal-silicide over the individualhigh-impedance word line resistors 408 is extended over the spine 410and the mask polygon 604 that is used to prevent the doping of theindividual high-impedance word line resistors 408 is also extended toprevent doping in the spine 410, thereby merging the spine 410 and theindividual high-impedance word line resistors 408 into a single largemultiple connection high-impedance resistor structure including highimpedance resistors 602. In this manner, the spine 410 is formed withoutdoping and without metal-silicide resulting in high impedance resistors602, thereby using less layout space in the memory device 600 for thespine 410 and the charge dissipation protection structure. The memorydevice 600 in accordance with this second memory embodiment conserveslayout space while providing a multiple connection structure thatadequately connects the individual word lines 406 to the groundingresistors 412 and through them to the polysilicon terminal of the thindielectric polysilicon to substrate capacitor 414.

Referring to FIGS. 15 and 16, a schematic diagram and a layout view,respectively, of a memory device 610 in accordance with a third memoryembodiment of the present invention are shown. The memory device 610 issimilar to the memory device 400 (FIGS. 9 and 10) except that the thindielectric polysilicon to substrate or polysilicon to doped wellcapacitor 414 is replaced with polysilicon to source-drain region 426(FIG. 16) buried contacts 612. Buried contacts 612 are contacts 614(FIG. 16) that extend directly from the polysilicon layer to theunderlying source-drain region 426 (FIG. 16) without having to connectthrough a subsequently formed metal layer. Like the thin dielectricpolysilicon to substrate or polysilicon to doped well capacitor chargepassage device 414 (FIG. 10), a charge passage device 612 using buriedcontacts 614 has the advantage of already existing in the memory device610 as soon as the polysilicon layer deposition begins, therebyproviding a charge passage device 612 for dissipating charge duringpolysilicon processing. As described above, the grounding resistors 412also serve the purpose of preventing high voltages that are placed onthe word lines 406 during programming and erase operations from reachingthe buried contact charge passage device 612.

Referring to FIGS. 17 and 18, a schematic diagram and a layout view,respectively, of a memory device 620 in accordance with a fourth memoryembodiment of the present invention are shown. The memory device 620 issimilar to the memory device 400 (FIGS. 9 and 10) except that the highimpedance word line resistors 408 are replaced with high impedancepolysilicon PIN diodes 622. Like the resistors 408 that they replace,these PIN diodes 622 are formed in a portion of polysilicon that has nothad metal-silicide formed on it. The high impedance PIN diodes 622 areformed by doping one end of a portion of the polysilicon layer with P+(acceptor type) dopant 624 and the other end of the portion with N+(donor type) dopant 422 while leaving the middle of the portion betweenthe doped regions without dopant to form the high impedance, nearlyinsulating portion of the PIN diodes 622. The PIN diodes 622 act asnearly open circuits when one polarity of voltage is applied and conductcurrent similar to the high impedance resistors 408 (FIG. 10) when theopposite polarity of voltage is applied.

Alternatively, low impedance diodes 622 can be provided. Low impedancediodes 622 are formed by doping the middle of the PIN diodes 622 witheither N or P type dopant. The low impedance diodes 622 act as highimpedances when one voltage polarity is applied and readily conduct inthe presence of the opposite voltage polarity. Whether the diodes 622provided are high impedance PIN diodes or low impedance diodes, thediodes 622 are oriented in such a fashion as to aid in the dissipationof harmful process-induced charge while not hindering the normalfunctioning of the product circuitry.

More particularly, with the N+ and P+ regions of the PIN diodes 622oriented in accordance with this fourth memory embodiment of the presentinvention as shown in FIGS. 17 and 18, the diodes 622 act as nearly opencircuits during normal read and programming operations (with positivevoltages applied to word lines 406) and act as high impedance forwardbiased diodes 622 during erase operations (negative voltages applied tothe word lines 406). As described above, during sector erase when all orsome of the word lines 406 in a sector are simultaneously drivennegative in voltage, the spine 410 is also drawn to a negative voltageby currents from the negatively biased word lines 406 and through theforward biased word line PIN diodes 622. The grounding resistors 412prevent the negative going spine 410 from directly shorting to ground.

Device characteristics for the memory device 620 can be optimized byappropriately choosing the lengths and widths of the undoped orlow-doped silicide-blocked portions 420, 424 of the polysilicon in thedevices 622, 412 and by appropriately choosing the doping levels anddoping profiles in the various portions 422, 624 of the polysilicondevices 622, 412.

Referring to FIGS. 19 and 20, a schematic diagram and a layout view,respectively, of a memory device 630 in accordance with a fifth memoryembodiment of the present invention are shown. The memory device 630 issimilar to the memory device 620 (FIGS. 17 and 18) except that the thindielectric polysilicon to substrate or polysilicon to doped wellcapacitor 414 is replaced with a polysilicon to source-drain region 426buried contact charge passage device 632. Like the thin dielectricpolysilicon to substrate or polysilicon to doped well capacitor chargepassage device 414 (FIG. 16), a charge passage device 632 using buriedcontacts 634 has the advantage of already existing in the memory device630 as soon as the polysilicon layer deposition begins, therebyproviding a charge passage device 632 for dissipating charge duringpolysilicon processing. As described above, the grounding resistors 412also serve the purpose of preventing high voltages that are placed onthe word lines 406 during programming and erase operations from reachingthe buried contact charge passage device 632.

Referring to FIG. 21, a layout diagram of an embodiment of the highimpedance undoped or lightly doped polysilicon resistors 408 is shown.The word lines 406 are connected to the individual, word lineprotection, high impedance resistors 408. The spine 410 ties the ends ofthe resistors 408 together and leads to devices which provide chargeleakage paths to the substrate. The resistors 408 are silicide blockedby masking 420 and either side of the resistors is doped by corepolysilicon doping or other N-type doping in regions 422.

Referring next to FIG. 22, a layout diagram of an embodiment of the highimpedance P+/Insulator/N+ (PIN) polysilicon diodes 622 is shown. Theword lines 406 are connected to the individual, word line protection,high impedance diodes 622. The spine 410 ties the P+ ends of the PINdiodes 622 together and leads to devices which provide charge leakagepaths to the substrate. The PIN diodes 622 are silicide blocked bymasking 420 and the sides of the PIN diodes connected to the word lines406 are doped by core polysilicon doping or other N-type doping in theregion 422 while the sides of the PIN diodes connected to the spine 410are doped by P-type doping in the region 624.

As with the charge dissipation protection structures described inaccordance with the memory embodiments above and shown in FIGS. 9, 10and 13 to 20, the memory embodiments described in FIGS. 23 to 36 includecharge dissipation structures suitable for protecting MirrorBit memorycore transistors from accumulating damaging amounts of process-inducedcharge. These charge dissipation protection structures are not limited,however, to MirrorBit memory implementations and can also be used toprotect similar gates of transistors and portions of other devices inother types of semiconductor memory cores such as floating gate FlashEPROMs, standard EPROMs, DRAMs and SRAMs.

Referring to FIGS. 23 and 24, a schematic diagram and a layout view,respectively, of a memory device 700 in accordance with a sixth memoryembodiment of the present invention are shown wherein each individualword line 406 is connected to its own high impedance polysiliconresistor 408. The word line protection resistors 408 are made inportions of the polysilicon that has had the normal metal-silicidedeposition and reaction blocked by blocking material with a shapedefined by masking 420, thereby forming gaps in the metal-silicide overthe polysilicon in the high impedance resistors 408. The resistors 408may be undoped or lightly doped.

One terminal of each high impedance resistor 408 is connected to one ofthe word lines 406 (each word line being connected to one resistor). Theother terminals of the resistors 408 are commonly connected to a pieceof polysilicon forming a spine 710. The spine 710 may be of low or highimpedance. There are normally one or two polysilicon spines 710 for eachmemory sector. While the spine 710 of FIG. 23 is connected to sixty-fourword line protection resistors 408, a hundred or more word lineprotection resistors 408 may be connected to a single spine 710.

In accordance with the sixth memory embodiment of the present invention,the polysilicon spine 710 also serves as a portion of the charge passagedevice 714, i.e., the device 714 that grounds the spine 710 to thesubstrate or to a doped well. Referring to FIG. 24, the polysiliconspine 710 is formed over the top of a source-drain region 716 residingin the substrate or in a doped well in the substrate.

Often in semiconductor fabrication technologies, the presence ofpolysilicon over a region of source-drain typically forms a thin gateoxide layer between the polysilicon and the source-drain region. Thesixth memory embodiment of the present invention takes advantage of thethin gate oxide formation so that formation of the polysilicon in thespine 710 over the source-drain region 716 as shown in FIG. 24 resultsin formation of a thin gate oxide 718. The thin gate oxide 718 allowsthe passage of process-induced charge that has accumulated on the memoryword lines 406 by either carrier tunneling or through oxide breakdown.In accordance with this sixth memory embodiment, formation of thepolysilicon in the spine 710 over the source-drain region 716 forms athin gate oxide capacitor charge passage device 714 wherein the chargepassage device 714 is incorporated into the spine 710. In this way thespine 710 serves in its previously mentioned role (see spine 410 inFIGS. 9, 10 and 13 through 22) to link the resistors 408 together whilealso acting as the charge passage device 714. The dielectric in the thingate oxide capacitor 714 formed from the deposition of the polysiliconover the source-drain region 716 is significantly thinner than the gatedielectrics of the oxide-nitride-oxide layer 418 of the MirrorBit coretransistors being protected.

As a result of incorporating charge passage devices 714 into the spines710, the memory device 700 in accordance with the sixth memoryembodiment of the present invention advantageously requires less layoutspace than the memory device 400 (FIGS. 9 and 10).

While the memory device 700 depicted in FIGS. 23 and 24 includes onlyone polysilicon spine 710 for the memory sector including word lines 406one to sixty-four, one or two polysilicon spines 710 could be providedfor each memory sector and the memory sector could have more or lessthan sixty-four word lines 406. All of the polysilicon devices 406, 408,710 are all portions of only one or two polygons of poly-silicon, eachpolygon including word lines 406, individual word line resistors 408,and one polysilicon spine 710. When two polysilicon spines 710 areprovided for a single memory sector, then half of the word lines 406 inthe sector connect through high impedance thin film resistors 408 to onespine 710 and the other half of the word lines 406 connect through highimpedance thin film resistors 408 to the other spine 710. Such astructure requires two polygons of polysilicon, each polygon containinghalf of the word lines 406, half of the individual word line resistors408 and one polysilicon spine 710.

The spine 710 formed partially in the poly-silicon and the word lines406 and the word line protection resistors 408 formed in the polysiliconare adequate for protecting the gates of the MirrorBit core transistorsfrom damaging levels of process induced charge. This charge wouldotherwise accumulate on the core transistor word lines 406 forming thegates due to process-induced charging during polysilicon etching. Addedprotection against process-induced charging is acquired during the firstmetallization step with the addition of a connection 416 through metaland contacts from the polysilicon in the spine 710 to the substrate orfrom the polysilicon in the spine 710 to a doped well residing in thesubstrate. This added connection 416 protects against charging that canoccur in processing subsequent to the first metal layer processing.

In accordance with the sixth memory embodiment of the present invention,the individual high impedance word line resistors 408 each have a lowenough impedance to allow adequate passage of charge during processing,thereby preventing damage from process-induced charging. However, theimpedance of each of the resistors 408 is large enough to virtuallyisolate each word line 406 from the rest of the word lines (even thoughcommonly connected through the resistors 408 to the spine 710) duringthe read, programming and erase phases of normal product operation.Unless prevented during erase when all of the word lines 406 in a sectorare simultaneously driven negative in voltage, the polysilicon in spine710 could also be drawn to a negative voltage by leakage currents fromthe word lines 406 through the word line resistors 408. Therefore, inaccordance with this sixth memory embodiment of the present invention,the resistances of the individual high impedance word line resistors 408of the memory device 700 are chosen large enough to prevent significantcurrent flow from the word lines 406 to the spine 710.

Referring to FIGS. 25 and 26, a schematic diagram and a layout view,respectively, of a memory device 720 in accordance with a seventh memoryembodiment of the present invention are shown. The memory device 720 issimilar to the memory device 700 (FIGS. 23 and 24) except that thecharge passage device 724, incorporated into the spine 722, includes,instead of the thin dielectric polysilicon to substrate or polysiliconto doped well capacitor 714, polysilicon to source-drain region 716buried contacts 726 extending directly from the polysilicon layer to theunderlying source-drain region 716 without having to connect through asubsequently formed metal layer. Like the thin dielectric polysilicon tosubstrate or polysilicon to doped well capacitor charge passage device714 (FIG. 23), a charge passage device 724 made of buried contacts 726has the advantage of already existing in the memory device 720 as soonas the polysilicon layer deposition begins, thereby providing a chargepassage device 724 for dissipating charge during polysilicon processing.In addition, layout space is conserved by the spine 722 incorporatingthe charge passage device 724.

Referring to FIGS. 27 and 28, a schematic diagram and a layout view,respectively, of a memory device 740 in accordance with an eighth memoryembodiment of the present invention are shown. The memory device 740 issimilar to the memory device 700 (FIGS. 23 and 24) except that the highimpedance word line resistors 408 are replaced with high impedance PINdiodes 622. Like the resistors 408 that they replace, these PIN diodes622 are formed in a portion of polysilicon that has not hadmetal-silicide formed on it. As described above, the high impedance PINdiodes 622 are formed by doping one end of a portion of the polysiliconlayer with P+ (acceptor type) dopant 624 and the other end of theportion with N+ (donor type) dopant 422 while leaving the middle of theportion between the doped regions without dopant to form the highimpedance, nearly insulating portion of the PIN diodes 622. The PINdiodes 622 act as nearly open circuits when one polarity of voltage isapplied and conduct current similar to the high impedance resistors 408(FIG. 24) when the opposite polarity of voltage is applied.

More particularly, with the N+ and P+ regions of the PIN diodes 622oriented in accordance with this eighth memory embodiment of the presentinvention as shown in FIGS. 27 and 28, the diodes 622 act as nearly opencircuits during normal read and programming operations (with positivevoltages applied to word lines 406) and act as high impedance forwardbiased diodes 622 during erase operations (negative voltages applied tothe word lines 406). While the PIN diodes 622 act as high impedancediodes in accordance with this eighth memory embodiment of the presentinvention, device characteristics for the memory device 740 cannevertheless be optimized by appropriately choosing the lengths andwidths of the undoped or low-doped silicide-blocked portions 420 of thepolysilicon in the PIN diodes 622 and by appropriately choosing thedoping levels and doping profiles in the various portions 422, 624 ofthe PIN diodes 622. Diode impedances can be chosen low enough so thatboth voltage polarities of the PIN diodes 622 can effectively passprocess induced charges during processing. However, as with theimpedances of the resistors 408 in FIGS. 23 and 24, the forward andreverse impedances of each PIN diode 622 are also large enough tovirtually isolate each word line 406 from the rest of the word lines(even though commonly connected through the PIN diodes 622 to the spine710) during the read, programming and erase phases of normal productoperation. Unless prevented during erase when all of the word lines 406in a sector are simultaneously driven negative in voltage, thepolysilicon in spine 710 could also be drawn to a negative voltage byleakage currents from the word lines 406 through the word line PINdiodes 622. Therefore, in accordance with this eighth memory embodimentof the present invention, the impedances of the individual highimpedance word line PIN diodes 622 of the memory device 740 are chosenlarge enough to prevent significant current flow from the word lines 406to the spine 710.

Referring to FIGS. 29 and 30, a schematic diagram and a layout view,respectively, of a memory device 760 in accordance with a ninth memoryembodiment of the present invention are shown. The memory device 760 issimilar to the memory device 740 (FIGS. 27 and 28) except that thecharge passage device 724, incorporated into the spine 722, includes,instead of the thin dielectric polysilicon to substrate or polysiliconto doped well capacitor 714, polysilicon to source-drain region 716buried contacts 726 extending directly from the polysilicon layer to theunderlying source-drain region 716 without having to connect through asubsequently formed metal layer. Like the thin dielectric polysilicon tosubstrate or polysilicon to doped well capacitor charge passage device714 (FIG. 28), the charge passage device 724 using buried contacts 726has the advantage of already existing in the memory device 760 as soonas the polysilicon layer deposition begins, thereby providing a chargepassage device 724 for dissipating charge during polysilicon processing.In addition, layout space is conserved by the spine 722 incorporatingthe charge passage device 724.

Referring to FIGS. 31 and 32 a schematic diagram and a layout view,respectively, of a memory device 800 in accordance with a tenth memoryembodiment of the present invention are shown. The memory device 800derives from combining portions of four instances of the memory device400 from the first memory embodiment of the present invention (FIGS. 9and 10). In memory device 800, portions of several memory devices 400are joined at a common interconnection node 810.

Interconnection node 810 is connected to ground via the first chargepassage device 414 and the second charge passage device 416. Chargepassage devices 414 and 416 in the tenth memory embodiment function in alike fashion to the charge passage devices 414 and 416 in the firstmemory embodiment of the present invention (FIGS. 9 and 10). In thetenth memory embodiment, spines 410, resistors 408 and 412 and wordlines 406 function in the same manner as do their counterparts in thefirst memory embodiment.

The interconnect at interconnection node 810 is composed of polysilicon.By using polysilicon for this interconnection node 810 (i.e., spine810), protection against in-process charging commences immediately afterdeposition of the polysilicon layer. Moreover, this protection alreadyexists and is functioning before the polysilicon layer is patterned andetched. Thus, charge developed on memory array word lines 406 during thepolysilicon etch processing step is safely shunted to ground viaresistors 408, spines 410, resistors 412, the polysiliconinterconnection node 810 and the charge passage devices 414 and 416.

The tenth memory embodiment has the advantage of allowing several corememory arrays 402 (FIGS. 9 and 31) to share as few as one charge passagedevice 414 and as few as one charge passage device 416. By sharingcharge passage devices among several memory arrays 402, as shown in FIG.31, the tenth memory embodiment accommodates the same amount of memoryas several instances of memory device 400, as shown in FIG. 9, withoutusing as much layout space for charge passage devices as do the severalseparate instances of memory device 400.

The layouts of shared charge passage devices 414 and 416 of the memorydevice 800 are typically optimized for shared operation. Thisoptimization involves increasing the size of the thin oxide capacitorarea in the charge passage device 414 of memory device 800 over the sizeof the charge passage device 414 in memory device 400. The area of thethin oxide capacitor is increased to accommodate the increased amount ofin-process charging associated with the larger number of word lines 406in the increased number of core memory arrays 402 protected by thecharge passage device 414 of memory device 800. The conductivity ofdevice 416 of memory device 800 can be similarly increased as needed byadding contacts to its two ends.

Referring to FIGS. 33 and 34 a schematic diagram and a layout view,respectively, of a memory device 850 in accordance with an eleventhmemory embodiment of the present invention are shown. Memory device 850is similar to memory device 800 in the tenth memory embodiment exceptthat memory device 850 uses three instances of charge passage device 414and three instances of charge passage device 416 to provide protectionagainst damage due to in-process charging of the word lines 406 in fourcore memory arrays 402. This particular embodiment is optimized forsmall layout area and layout convenience in MirrorBit memories and thesharing of charge passage devices in memory device 850 allows theembodiment to be laid out more easily and the embodiment's layout tooccupy less layout space.

The size advantages of memory devices 800, 850 hold even when the chargepassage devices 414 and 416 used in memory devices 800, 850 are largerthan the charge passage devices 414 and 416 used in memory device 400(FIGS. 9 and 10). In addition to requiring fewer charge passage devices,the size advantages of memory devices 800, 850 over memory device 400are also realized because a small number of larger charge passagedevices 414 (in memory devices 800 and 850) more efficiently pass chargethan do a large number of smaller charge passage devices 414 (as inmemory device 400). Efficiency is defined here as the charge passagecapacity divided by the amount of layout area consumed by the devicesthat pass that charge. For example, two smaller charge passage devices414, each having half the thin oxide area of a single large chargepassage device 414 (and each thus having half of the charge passagecapability), require a larger total layout space than does the singlelarge charge passage device 414. The larger device's advantage is due tominimum device to device spacing requirements and to the other layoutoverhead effects that would occur at device edges in the two smallercharge passage devices. Similarly, two smaller charge passage devices416, each having one half of the conductivity of a single larger chargepassage device 416, require more overall layout space than does thesingle larger charge passage device 416.

Note that, although the particular instances of memory device 800 shownin FIGS. 31 and 32 and memory device 850 shown in FIGS. 33 and 34provide the same or better protection against damage due to in-processcharging as four instances of memory device 400, the general memorydevices 800 and 850 are not limited to connections to just four corememory arrays. Other versions of devices 800 and 850 could just asreadily be implemented so as to protect a very large number (thousandsfor example) of core memory arrays against the effects of in-processcharging.

In a similar manner to the procedure described for combining multipleinstances of the first memory embodiment (FIGS. 9 and 10) to form atenth and an eleventh memory embodiment (FIGS. 31 and 32 and FIGS. 33and 34), multiple instances of the second memory embodiment describedpreviously in FIGS. 13 and 14 are combined to form a twelfth and athirteenth memory embodiment. Again, one or more charge passage devices414 are shared among the protection circuits for two or more core memorysectors. Similarly, one or more charge passage devices 416 are sharedamong the protection circuits for two or more core memory sectors. Oneexample of a circuit for the thirteenth memory embodiment merelyconsists of the circuit shown in FIG. 33 with the spine 410 of thememory embodiment shown in FIG. 13 substituted for each of the threespines 410 in FIG. 33. Each of the spines in the thirteenth memoryembodiment also contains the resistors 602 shown in the spine 410 inFIG. 13.

Similarly, the relevant variations among the devices in the thirdthrough fifth memory embodiments shown in FIGS. 15 through 20 aresubstituted for their counterparts in the tenth and eleventh memoryembodiments FIGS. 31, 32, 33 and 34 to form other memory embodiments.Example circuits for these various memory embodiments are created bysimple substitution. The circuits for the fourteenth and fifteenthmemory embodiments are created from the circuits in FIGS. 31 and 33 bysubstituting the buried contact charge passage device 612 of FIG. 15 forthe charge passage device 414 in the circuit of FIG. 31 and for thecharge passage devices 414 in the circuit of FIG. 33. The circuits forthe sixteenth and seventeenth memory embodiments are created from thecircuits of FIGS. 31 and 33 by substituting the high impedancepolysilicon PIN diodes 622 of FIG. 17 for the high impedance resistors408 in the circuit of FIG. 31 and for the high impedance resistors 408in the circuit of FIG. 33. The circuit for the eighteenth memoryembodiment is created from the circuit of FIG. 31 by first substitutingthe buried contact charge passage device 632 of FIG. 19 for the chargepassage device 414 in the circuit of FIG. 31. This creates a modifiedversion of the circuit shown in FIG. 31. This step is followed bysubstituting the high impedance polysilicon PIN diodes 622 of FIG. 19for the high impedance resistors 408 in the modified version of thecircuit in FIG. 31. This completes the eighteenth memory embodiment.Similarly, the buried contact charge passage device 632 of FIG. 19 issubstituted for each of the charge passage devices 414 in the circuitshown in FIG. 33 to create a modified version of the circuit shown inFIG. 33. Then the PIN diodes 622 of FIG. 19 are substituted for the highimpedance resistors 408 in the modified version of the circuit in FIG.33. This completes the nineteenth memory embodiment.

Referring to FIGS. 35 and 36 a schematic diagram and a layout view,respectively, of a memory device 900 in accordance with a twentiethmemory embodiment of the present invention are shown. The particularmemory device 900 derives from combining portions of four instances ofthe memory device 700 from the sixth memory embodiment of the presentinvention (FIGS. 23 and 24). In memory device 900, portions of severalmemory devices 700 are joined at a common node 910 as shown in FIGS. 35and 36.

Similar to how the polysilicon spine 710 (FIGS. 23 and 24) in the sixthmemory embodiment of the present invention serves as a charge passagedevice 714, the polysilicon spine 910 in the twentieth memory embodimentserves as several charge passage devices 714, i.e., the devices 714 thatground the spine 910 to the substrate or to a doped well. Referring toFIG. 36, the polysilicon spine 910 is formed over the top of severalsource-drain regions 716 residing in the substrate or in one or moredoped wells in the substrate.

As in the sixth memory embodiment, in the twentieth memory embodimentthe presence of polysilicon over a region of source-drain forms a thingate oxide layer between the polysilicon and the source-drain region.The twentieth memory embodiment takes advantage of the thin gate oxideformation so that formation of the polysilicon in the spine 910 over theseveral source-drain regions 716 as shown in FIG. 36 results in theformation of several regions of thin gate oxide 718. These regions ofthin gate oxide act as the charge passage devices 714 (FIG. 35). Thuscharge passage devices 714 are thin gate oxide capacitors and areincorporated into spine 910. The thin gate oxide 718 allows the passageof process-induced charge that has accumulated on the memory word lines406 either by carrier tunneling or through oxide breakdown.

The dielectric in the thin gate oxide charge passage devices 714 formedfrom the deposition of the polysilicon over the source-drain regions 716is significantly thinner than the gate dielectric of theoxide-nitride-oxide layer 418 of the MirrorBit core transistors beingprotected. The thinner dielectric oxide of charge passage device 714ensures that device 714 will pass charge much more readily than will thethicker oxide-nitride-oxide gate dielectric of the core cells beingprotected. In this way the spine serves not only in its previouslymentioned role (see 410 in FIGS. 9, 10 and 13 through 22) of linking theresistors 408 together but also acts as the charge passage devices 714.

By using polysilicon for this interconnect (for this spine 910), theprotection of the device 900 against in-process charging commencesimmediately after deposition of the polysilicon layer. Moreover, thisprotection already exists and is functioning before the polysiliconlayer is patterned and etched. Thus, charge developed on memory arrayword lines 406 during the polysilicon etch processing step is safelyshunted to ground via resistors 408, spines 910 and the charge passagedevices 714.

Charge passage devices 714 in the twentieth memory embodiment 900function in a like fashion to the charge passage device 714 in the sixthmemory embodiment of the present invention (FIGS. 23 and 24). In thetwentieth memory embodiment 900, spines 910, resistors 408 and wordlines 406 also function in similar manners to their counterparts in thesixth memory embodiment (FIGS. 23 and 24).

Together, the spine 910 with its charge passage devices 714 formedpartially in the poly-silicon, the word lines 406 formed in thepolysilicon, and the word line protection resistors 408 formed in thepolysilicon are adequate for protecting the gates of the MirrorBit coretransistors from the damaging levels of process-induced charge thatwould otherwise accumulate on the core transistor word lines 406 duringpolysilicon etching, wherein the core transistor word lines 406 form thegates of the MirrorBit core transistors.

Added protection against process-induced charging is acquired during thefirst metallization step with the addition of a connection 416 throughmetal and contacts from the polysilicon in the spine 910 to thesubstrate or from the polysilicon in the spine 910 to a doped wellresiding in the substrate. This added connection 416 protects againstcharging that can occur in processing that is subsequent to the firstmetal layer processing. Charge passage device 416 in the twentiethmemory embodiment depicted in FIGS. 35 and 36 functions in a likefashion to the charge passage device 416 in the sixth memory embodimentof the present invention as shown in FIGS. 23 and 24.

Significant layout space advantage is realized by the memory device 900combining several spines 710 (FIGS. 23 and 24) for several core memoryarrays 402 (FIGS. 23 and 24) into one spine 910 (FIGS. 35 and 36) andthen connecting that spine to ground through multiple charge passagedevices 714 and as few as one charge passage device 416 (FIGS. 35 and36). As compared with the sixth memory embodiment depicted in FIGS. 23and 24, this sharing of a single charge passage device 416 among severalinstances of core memory arrays 402 (FIGS. 23 and 35) is key to savinglayout space in the memory device 900 in the twentieth memoryembodiment.

The layout of the shared charge passage device 416 of the memory device900 is typically optimized for shared operation. This optimizationinvolves increasing the conductivity of charge passage device 416 inmemory device 900 relative to the conductivity of device 416 in memorydevice 700 (FIGS. 23 and 24) by adding contacts to device 416 in memorydevice 900. The conductivity of memory device 900's charge passagedevice 416 is increased to accommodate the increased amount ofin-process charging associated with the larger number of word lines 406in the increased number of core memory arrays 402 protected by memorydevice 900's charge passage device 416.

Despite adding these contacts to the charge passage device 416 of thememory device 900, the size advantage of the memory device 900 stillholds even given the larger size of the charge passage device 416 of thememory device 900. The size advantage of the memory device 900 isrealized partly because a single instance of a larger charge passagedevice 416 (in device 900) more efficiently passes charge than can anumber of smaller charge passage devices 416 (as in device 700) where,as before, efficiency is defined as the charge passage capacity dividedby the amount of layout area consumed by the devices that pass thatcharge. For example, two smaller charge passage devices 416, each havinghalf the number of contacts of a single larger charge passage device 416(and each thus having half of the charge passage capability), require alarger total layout space than does the single larger charge passagedevice 416.

The twentieth memory embodiment is optimized for small layout area andlayout convenience in MirrorBit memories. The sharing of charge passagedevices among multiple core memory arrays allows the twentiethembodiment to be laid out more easily and the layout thereof to occupyless layout space.

While the memory device 900 depicted in FIGS. 35 and 36 includes onlyone polysilicon spine 910 for the four memory arrays including wordlines 406 one to sixty-four in each array, two polysilicon spines 910could be provided for the memory arrays and each memory array could havemore or less than sixty-four word lines 406. All of the polysilicondevices 406, 408, 910 are all portions of only one or two polygons ofpoly-silicon, each polygon including word lines 406, individual wordline resistors 408, and one polysilicon spine 910. When two polysiliconspines 910 are provided for the memory arrays, then half of the wordlines 406 in each array connect through high impedance thin filmresistors 408 to one spine 910 and the other half of the word lines 406connect through high impedance thin film resistors 408 to the otherspine 910. Such a structure requires two polygons of polysilicon, eachpolygon containing half of the word lines 406, half of the individualword line resistors 408 and one polysilicon spine 910.

Note that, although the particular instance of memory device 900 shownin FIGS. 35 and 36 provides the same or better protection against damagedue to in-process charging as four instances of memory device 700, thegeneral memory device 900 is not limited to connections to just fourcore memory arrays. Other versions of device 900 could just as readilybe implemented so as to protect a very large number (thousands forexample) of core memory arrays against the effects of in-processcharging.

In a similar manner to that described for combining multiple instancesof device 700 of the sixth memory embodiment (FIGS. 23 and 24) to formthe twentieth memory embodiment (FIGS. 35 and 36), multiple instances ofthe seventh memory embodiment described previously in FIGS. 25 and 26are combined to form a twenty-first memory embodiment. Again, one ormore charge passage devices 416 are shared among the protection circuitsfor two or more core memory sectors. One example of a circuit for thetwenty-first memory embodiment merely consists of the circuit shown inFIG. 35 with the spine 722 of the memory embodiment shown in FIG. 25substituted for the corresponding portions of the combined spine 910 inFIG. 35. In the twenty-first memory embodiment, the charge passagedevices 714 in the circuit of FIG. 35 are replaced with the chargepassage device 724 of FIG. 25. The charge passage device 724 haspolysilicon to source-drain region 716 buried contacts 726 extendingdirectly from the polysilicon layer to the underlying source-drainregion 716.

Similarly, the relevant variations among the devices in the eighth andninth memory embodiments shown in FIGS. 27 through 30 are substitutedfor their counterparts in the twentieth memory embodiment FIGS. 35 and36 to form other memory embodiments. Example circuits for these variousmemory embodiments are created by simple substitution. The circuit for atwenty-second memory embodiment is created from the circuit in FIG. 35by substituting the high impedance polysilicon PIN diodes 622 of FIG. 27for the high impedance resistors 408 in the circuit of FIG. 35. Thecircuit for a twenty-third memory embodiment is created from the circuitin FIG. 35 by first substituting the buried contact charge passagedevice 724 of FIG. 29 for the charge passage devices 714 in the circuitof FIG. 35. This procedure creates a modified version of the circuit inFIG. 35. This substitution is followed by substituting the highimpedance polysilicon PIN diodes 622 of FIG. 29 for the high impedanceresistors 408 in the modified version of the circuit in FIG. 35.

While exemplary embodiments have been presented in the foregoingdetailed description, it should be appreciated that a vast number ofvariations exist. It should also be appreciated that the exemplaryembodiments are only examples, and are not intended to limit the scope,applicability, or configuration of the invention in any way. Rather, theforegoing detailed description will provide those skilled in the artwith a convenient road map for implementing an exemplary embodiment ofthe invention, it being understood that various changes may be made inthe function and arrangement of elements described in an exemplaryembodiment without departing from the scope of the invention as setforth in the appended claims.

1. A semiconductor device comprising: a substrate; an at leastsemiconductive layer, wherein the at least semiconductive layer iseither a semiconductive layer or a conductive layer; one or more thinfilm devices connected to the at least semiconductive layer fordissipating charge therefrom; and a charge passage device coupled to theone or more thin film devices and to the substrate for providing aconnection from the one or more thin film devices to the substrate todissipate charge from the at least semiconductive layer to thesubstrate.
 2. The semiconductor device of claim 1 wherein thesemiconductor device comprises a memory device including one or morecore memory arrays, each of the one or more core memory arrays having aplurality of word lines, and wherein the at least semiconductive layerincludes the plurality of word lines.
 3. The semiconductor device ofclaim 2 wherein the one or more thin film devices includes a pluralityof thin film devices coupled to each of the one or more core memoryarrays, and wherein each of the plurality of word lines is connected toone of the plurality of thin film devices.
 4. The semiconductor deviceof claim 2 wherein the memory device includes a plurality of core memoryarrays.
 5. The semiconductor device of claim 4 wherein the one or morethin film devices includes a plurality of thin film devices coupled toeach of the plurality of core memory arrays, and wherein each of theplurality of word lines is connected to one of the plurality of thinfilm devices.
 6. The semiconductor device of claim 5 further comprisinga spine coupled to the one or more core memory arrays and connected toeach of the plurality of thin film devices, the spine also connected tothe charge passage device to provide the connection from the pluralityof thin film devices to the substrate to dissipate charge from theplurality of word lines to the substrate.
 7. The semiconductor device ofclaim 6 further comprising one or more additional charge passagedevices, each of the charge passage device and the one or moreadditional charge passage devices connected to the spine to providemultiple connections from the plurality of thin film devices to thesubstrate to dissipate charge from the plurality of word lines to thesubstrate.
 8. The semiconductor device of claim 1 wherein the substrateincludes a doped well formed therein and wherein the charge passagedevice couples the one or more thin film devices to the doped well. 9.The semiconductor device of claim 1 wherein the one or more thin filmdevices comprise one or more high impedance thin film devices.
 10. Thesemiconductor device of claim 9 wherein the one or more high impedancethin film devices comprise one or more high impedance thin filmresistors.
 11. The semiconductor device of claim 9 wherein the one ormore high impedance thin film devices comprise one or more highimpedance thin film diodes.
 12. The semiconductor device of claim 11wherein the one or more high impedance thin film diodes comprise one ormore P+/Insulator/N+ (PIN) diodes.
 13. The semiconductor device of claim1 wherein the one or more thin film devices are integrally formed in theat least semiconductive layer.
 14. The semiconductor device of claim 13wherein the one or more thin film devices transport charge from a firstportion of the at least semiconductive layer to a second portion of theat least semiconductive layer, the second portion of the at leastsemiconductive layer connected to the charge passage device.
 15. Thesemiconductor device of claim 14 wherein the first portion of the atleast semiconductive layer comprises a gate of one or more transistors.16. The semiconductor device of claim 1 wherein the at leastsemiconductive layer includes a gate of one or more transistors.
 17. Thesemiconductor device of claim 1 wherein the at least semiconductivelayer is a polysilicon layer.
 18. The semiconductor device of claim 1wherein the charge passage device comprises a gate oxide capacitor. 19.The semiconductor device of claim 1 wherein the charge passage devicecomprises a buried contact.
 20. The semiconductor device of claim 1wherein the charge passage device comprises a thin gate oxide chargeleakage device connecting the one or more thin film devices to thesubstrate.
 21. The semiconductor device of claim 20 wherein thesubstrate comprises source-drain contacts and wherein the charge passagedevice additionally comprises a metal layer connecting the one or morethin film devices to the source-drain contacts.
 22. The semiconductordevice of claim 1 wherein the one or more thin film devices include aplurality of thin film devices, the semiconductor device furthercomprising a spine connected to each of the plurality of thin filmdevices, the spine also connected to the charge passage device toprovide the connection from the plurality of thin film devices to thesubstrate to dissipate charge from the at least semiconductive layer tothe substrate.
 23. The semiconductor device of claim 22 wherein thespine includes one or more high impedance resistors connected betweenconnections of the plurality of thin film devices to the spine.
 24. Amethod for forming a semiconductor device comprising the steps of:providing a substrate; forming a charge passage device coupled to thesubstrate; forming one or more thin film devices coupled to the chargepassage device; and forming an at least semiconductive layer connectedto the thin film devices such that in-process charges forming in the atleast semiconductive layer during processing after forming the at leastsemiconductive layer will be dissipated to the substrate through aconnection to the substrate provided by the one or more thin filmdevices and the charge passage device.
 25. The method for forming asemiconductor device of claim 24 further including the step of dopingthe substrate to form a doped well therein, and wherein the step offorming the charge passage device comprises the step of forming thecharge passage device coupled to the substrate coupled to the dopedwell.
 26. The method for forming a semiconductor device of claim 24wherein the step of forming the one or more thin film devices comprisesthe step of forming one or more high impedance thin film devices coupledto the charge passage device.
 27. The method for forming a semiconductordevice of claim 26 wherein the step of forming the one or more thin filmdevices comprises the steps of: depositing a semiconductive layer; anddoping at least portions of the semiconductive layer to form one or morehigh impedance thin film resistors.
 28. The method for forming asemiconductor device of claim 26 wherein the step of forming the one ormore thin film devices comprises the steps of: depositing asemiconductive layer; and doping at least portions of the semiconductivelayer to form one or more high impedance thin film diodes.
 29. Themethod for forming a semiconductor device of claim 28 wherein the dopingstep comprises the step of doping at least portions of thesemiconductive layer to form one or more P+/Insulator/N+ (PIN) diodes.30. The method for forming a semiconductor device of claim 24 whereinthe steps of forming the one or more thin film devices and forming theat least semiconductive layer are formed together such that the one ormore thin film devices are integrally formed in the at leastsemiconductive layer.
 31. The method for forming a semiconductor deviceof claim 30 wherein the step of forming the one or more thin filmdevices and the at least semiconductive layer together comprises formingthe at least semiconductive layer having a first portion and a secondportion wherein the one or more thin film devices are integrally formedin the second portion of the at least semiconductive layer to transportcharge from the first portion of the at least semiconductive layerthrough the second portion thereof to the charge passage device.
 32. Themethod for forming a semiconductor device of claim 31 wherein the stepof forming the at least semiconductive layer comprises the steps of:depositing a polysilicon layer to form the first portion and the secondportion of the at least semiconductive layer; and doping the secondportion of the polysilicon layer to integrally form the one or more thinfilm devices therein.
 33. The method for forming a semiconductor deviceof claim 31 wherein the step of forming the at least semiconductivelayer comprises the step of forming a gate of one or more transistors inthe first portion of the at least semiconductive layer.
 34. The methodfor forming a semiconductor device of claim 24 wherein the step offorming the at least semiconductive layer comprises the step of forminga gate of one or more transistors.
 35. The method for forming asemiconductor device of claim 24 wherein the step of forming the atleast semiconductive layer comprises the step of depositing apolysilicon layer.
 36. The method for forming a semiconductor device ofclaim 24 wherein the step of forming the charge passage device comprisesthe step of forming a gate oxide capacitor.
 37. The method for forming asemiconductor device of claim 24 wherein the step of forming the chargepassage device comprises the step of forming a buried contact.
 38. Themethod for forming a semiconductor device of claim 24 wherein the stepof forming the charge passage device comprises the step of forming athin gate oxide charge leakage device for connecting the one or morethin film devices to the substrate.
 39. The method for forming asemiconductor device of claim 38 wherein the step of providing thesubstrate comprises the step of providing a substrate includingsource-drain contacts and wherein the step of forming the charge passagedevice comprises the step of forming a metal layer for connecting theone or more thin film devices to the source-drain contacts.
 40. Themethod for forming a semiconductor device of claim 24 wherein the stepof forming the one or more thin film devices comprises the steps of:forming a plurality of thin film devices; and forming a spine connectedto each of the plurality of thin film devices and connected to thecharge passage device to provide the connection from the plurality ofthin film devices to the substrate to dissipate charge from the at leastsemiconductive layer to the substrate.
 41. The method for forming asemiconductor device of claim 40 wherein the step of forming the spinecomprises the step of forming one or more high impedance resistorsconnected between each connection of the plurality of thin film devicesto the spine.
 42. The method for forming a semiconductor device of claim24 wherein the steps of forming the charge passage device, forming theone or more thin film devices and forming the at least semiconductivelayer are at least partially formed in a single polysilicon depositionprocessing step.
 43. The method for forming a semiconductor device ofclaim 24 further comprising the step of shorting out the charge passagedevice before completing formation of the semiconductor device.
 44. Themethod for forming a semiconductor device of claim 24 further comprisingthe step of forming memory core devices and periphery devices, andwherein the step of forming the charge passage device comprises the stepof epitaxially growing a gate oxide layer, and wherein the step offorming the at least semiconductive layer comprises the step ofdepositing a first polysilicon layer, and wherein the step of formingthe one or more thin film devices comprises the step of doping portionsof the polysilicon layer.
 45. The method for forming a semiconductordevice of claim 44 further comprising the steps of: depositing a secondpolysilicon layer; masking the first and second polysilicon layers;selectively doping the at least semiconductive layer to adjust theimpedances of high impedance portions of the one or more thin filmdevices; etching the periphery devices; implanting the core devices andthe periphery devices; and shorting the charge passage device beforecompleting formation of the semiconductor device.